Semiconductor package structure

ABSTRACT

The present disclosure provides a semiconductor package, including a substrate having a first surface and a second surface opposite to the first surface, a semiconductor die connected to the first surface of the substrate, and a conductive bump connected to the conductive via at the second surface. The substrate includes a conductive line surrounded by a dielectric and a conductive via connected to the conductive line and penetrating the dielectric at the second surface.

PRIORITY CLAIM AND CROSS REFERENCE

This application is a Continuation-In-Part of U.S. application Ser. No. 16/205,916, filed Nov. 30, 2018, which is a Divisional of U.S. application Ser. No. 15/239,295, filed Aug. 17, 2016, and claims priority to a U.S. provisional application No. 62/353,826, filed Jun. 23, 2016.

BACKGROUND

Semiconductor devices are used in a variety of electronic applications, such as personal computers, cell phones, digital cameras, and other electronic equipment. The fabrication of semiconductor devices involves sequentially depositing insulating or dielectric layers, conductive layers, and semiconductor layers over a semiconductor substrate, and patterning the various material layers using lithography and etching processes to form circuit components and elements on the semiconductor substrate.

The semiconductor industry continues to improve the integration density of various electronic components (e.g., transistors, diodes, resistors, capacitors, etc.) by continual reductions in minimum feature size, which allows more components to be integrated into a given area. The number of input and output (I/O) connections is significantly increased. Smaller package structures, that utilize less area or smaller heights, are developed to package the semiconductor devices. For example, in an attempt to further increase circuit density, three-dimensional (3D) ICs have been investigated.

New packaging technologies have been developed to improve the density and functionality of semiconductor devices. These relatively new types of packaging technologies for semiconductor devices face manufacturing challenges.

BRIEF DESCRIPTION OF THE DRAWINGS

Aspects of the present disclosure are best understood from the following detailed description when read with the accompanying figures. It is noted that, in accordance with the standard practice in the industry, various features are not drawn to scale. In fact, the dimensions of the various features may be arbitrarily increased or reduced for clarity of discussion.

FIG. 1 is a cross sectional view of a semiconductor package, in accordance with some embodiments of the present disclosure;

FIG. 2 shows a portional enlarged cross sectional view of a semiconductor package, in accordance with some embodiments of the present disclosure;

FIG. 3 shows a portional enlarged cross sectional view of a semiconductor package, in accordance with some embodiments of the present disclosure;

FIG. 4 shows a portional enlarged cross sectional view of a semiconductor package, in accordance with some embodiments of the present disclosure;

FIG. 5 shows a cross sectional view of a semiconductor package, in accordance with some embodiments of the present disclosure;

FIG. 6 shows a cross sectional view of a semiconductor package, in accordance with some embodiments of the present disclosure;

FIG. 7A to FIG. 7H show cross sectional views of a sequence of a method for manufacturing a semiconductor package, in accordance with some embodiments of the present disclosure;

FIG. 8A to FIG. 8H show cross sectional views of a sequence of a method for manufacturing a semiconductor package, in accordance with some embodiments of the present disclosure;

FIG. 9 shows a cross sectional view of a semiconductor package, in accordance with some embodiments of the present disclosure;

FIG. 10 shows a cross sectional view of a semiconductor package, in accordance with some embodiments of the present disclosure;

FIG. 11A shows a cross sectional view of a semiconductor package, in accordance with some embodiments of the present disclosure;

FIG. 11B shows a cross sectional view of a semiconductor package, in accordance with some embodiments of the present disclosure;

FIG. 12A shows a cross sectional view of a semiconductor package, in accordance with some embodiments of the present disclosure; and

FIG. 12B shows a cross sectional view of a semiconductor package, in accordance with some embodiments of the present disclosure.

DETAILED DESCRIPTION

The following disclosure provides many different embodiments, or examples, for implementing different features of the provided subject matter. Specific examples of components and arrangements are described below to simplify the present disclosure. These are, of course, merely examples and are not intended to be limiting. For example, the formation of a first feature over or on a second feature in the description that follows may include embodiments in which the first and second features are formed in direct contact, and may also include embodiments in which additional features may be formed between the first and second features, such that the first and second features may not be in direct contact. In addition, the present disclosure may repeat reference numerals and/or letters in the various examples. This repetition is for the purpose of simplicity and clarity and does not in itself dictate a relationship between the various embodiments and/or configurations discussed.

Further, spatially relative terms, such as “beneath,” “below,” “lower,” “above,” “upper” and the like, may be used herein for ease of description to describe one element or feature's relationship to another element(s) or feature(s) as illustrated in the figures. The spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. The apparatus may be otherwise oriented (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein may likewise be interpreted accordingly.

Notwithstanding that the numerical ranges and parameters setting forth the broad scope of the disclosure are approximations, the numerical values set forth in the specific examples are reported as precisely as possible. Any numerical value, however, inherently contains certain errors necessarily resulting from the standard deviation found in the respective testing measurements. Also, as used herein, the term “about” generally means within 10%, 5%, 1%, or 0.5% of a given value or range. Alternatively, the term “about” means within an acceptable standard error of the mean when considered by one of ordinary skill in the art. Other than in the operating/working examples, or unless otherwise expressly specified, all of the numerical ranges, amounts, values and percentages such as those for quantities of materials, durations of times, temperatures, operating conditions, ratios of amounts, and the likes thereof disclosed herein should be understood as modified in all instances by the term “about.” Accordingly, unless indicated to the contrary, the numerical parameters set forth in the present disclosure and attached claims are approximations that can vary as desired. At the very least, each numerical parameter should at least be construed in light of the number of reported significant digits and by applying ordinary rounding techniques. Ranges can be expressed herein as from one endpoint to another endpoint or between two endpoints. All ranges disclosed herein are inclusive of the endpoints, unless specified otherwise.

Various embodiments include methods and corresponding structures for forming a semiconductor device package. Various embodiments integrate multiple functional chips in a single device package and implements Chip-to-Wafer (e.g., known good die) for Chip-on-Wafer (CoW) level packaging. Functional chips may be directly bonded to other functional chips using bonding layers (e.g., by fusion bonding and/or hybrid bonding) in order to reduce the need to form solder bumps (e.g., microbumps) and underfill. Various embodiments may further advantageously provide a system-in-package (SiP) solution with smaller form factor, increased input/output density, and low via aspect ratio. Thus, manufacturing errors and costs can be reduced.

This application relates to a semiconductor package and its manufacturing method, and more particularly to a semiconductor package having constant manufacturing cost with increasing conductive pad counts, e.g., I/O counts, per chip and a manufacturing method thereof.

The trend of higher I/O counts per chip is in urgent need. Conventional laser drill operation to open I/O contact from a polymer layer is suffered from low critical dimension uniformity and high overlay shift, rendering delamination between the polymer layer and molding compound surrounding the I/O bump. A greater area enclosure of the I/O contact shall be preserved as a penalty for the laser drill operation, and hence the pitch of the I/O bump cannot be shrinked. Normally a 20 micrometer thick circumferencial region is preserved for the laser drilling overlay problem.

The general purpose of the present disclosure provides one or more of the following advantages: (1) forming smaller pitch I/O bump at constant cost; (2) capable for manufacturing both small and large pitch I/O bump; (3) requiring smaller area enclosure, e.g., smaller than a 7 micrometer thick circumferencial region, because of good critical dimension uniformity and smaller overlay shift; (4) decreasing critical dimension of the I/O bump; (5) providing better solder-I/O bump joint strength; (6) providing lower backside packaging joint standoff height.

The present disclosure provides a semiconductor package with a shallow trench in the polymer layer prior to the formation of an I/O bump. The shallow trench may possess a tapered sidewall. A seed layer is between the tapered sidewall of a shallow trench and the I/O bump.

The present disclosure also provides a manufacturing method of a semiconductor package. The method comprises forming a shallow trench in a polymer layer by a lithography operation, forming an I/O bump in the shallow trench, and etching the polymer layer to expose the I/O bump.

Referring to FIG. 1, FIG. 1 is a cross sectional view of a semiconductor package 10, in accordance with some embodiments of the present disclosure. Semiconductor package 10 includes a first semiconductor die layer 101 and a second semiconductor die layer 102. Second semiconductor die layer 102 further includes a packaged die 1021. Packaged die 1021 has a, for example, stacked die encapsulated by molding compound and disposed over a carrier. The stacked die includes multiple dies vertically stacked and wire-bonded to the conductive traces on the carrier. Wire bonding can be used to make the electrical connections from chip components such as chip resistors or chip capacitors to substrate. Two function chips are stacked on top of a plurality of substrate layers. The chips are connected to the substrate by a plurality of bonding gold wires. Other form of wires such as aluminum wire can be used, too. The function chips, the gold wire, and the substrate form a wire bonding (WB) package. In some embodiments, the packaged die 1021 is a memory die, e.g., a DRAM or a NAND flash. The molding compound can be an epoxy, polyimide, silicone rubber, the like, or a combination thereof. The molding compound can be applied using acceptable techniques, such as compression molding. As shown in FIG. 1, the first semiconductor die layer 101 includes an active surface 101A and a passive surface 101B or a back surface. The passive surface 101B is encapsulated by molding compound and an insulating layer 1012 is disposed over the passive surface 101B. In some embodiments, as not shown in FIG. 1, the insulating layer 1012 is in direct contact with the passive surface 101B.

First semiconductor die layer 101 broadly includes a plurality of dies 121, 123, and electrical connection extending from the active surface 101A of the dies 121, 123. In some embodiments, dies 121, 123 are silicon-on-chip (SOC) die flip-chip bonded to redistribution layer (RDL) 1011. For example, the electrical connection connects the active surface 101A of die 121 to the RDL 1011, and further to a solder bump 103 through a conductive contact 1013. In some embodiments, the solder bump 103 is a controlled collapse chip connection (C4) bump. Active surface 101A includes interconnect structure extending from the body of the dies 121, 123. Interconnect structure may include inter-layer dielectric (ILD) and/or inter-metal dielectric (IMD) layers containing conductive features (e.g., conductive lines and vias comprising copper, aluminum, tungsten, combinations thereof, and the like) formed using any suitable method. The ILD and IMD layers may include low-k dielectric materials having k values, for example, lower than about 4.0 or even 2.0 disposed between such conductive features. In some embodiments, the ILD and IMD layers may be made of, for example, phosphosilicate glass (PSG), borophosphosilicate glass (BPSG), fluorosilicate glass (FSG), SiO_(x)C_(y), Spin-On-Glass, Spin-On-Polymers, silicon carbon material, compounds thereof, composites thereof, combinations thereof, or the like, formed by any suitable method, such as spinning, chemical vapor deposition (CVD), and plasma-enhanced CVD (PECVD). Interconnect structure electrically connects various active devices to form functional circuits within dies 121, 123, The functions provided by such circuits may include logic structures, memory structures, processing structures, sensors, amplifiers, power distribution, input/output circuitry, or the like. One of ordinary skill in the art will appreciate that the above examples are provided for illustrative purposes only to further explain applications of various embodiments and are non-limiting. Other circuitry may be used as appropriate for a given application.

As shown in FIG. 1, the conductive contact 1013 is a through insulator via (TIV) penetrating through the molding compound encapsulating dies 121, 123 and the insulating layer 1012. Alternatively stated, a portion of the sidewall of the TIV is surrounded by the insulating layer 1012. In some embodiments, a seed layer 105 can be observed between the portion of the sidewall of the TIV and the insulating layer 1012. Details of the joint A between the TIV and the solder bump 103 are illustrated in FIG. 2 to FIG. 4 of the present disclosure.

In some embodiments, the dies 121, 123 can be known good dies (KGD) determined by a testing or probing operation. The KGD is attached using a pick-and-place tool. A basic flip-chip (FC) packaging technology comprises an IC, an interconnect system, and a substrate. A function chip is connected to the substrate with a plurality of solder bumps, wherein the solder bumps forming a metallurgical interconnection between the chip and the substrate. The function chip, the solder bump, and the substrate form a flip-chip package.

As shown in FIG. 1, semiconductor package 10 further includes a ball grid array (BGA) 107 electrically coupled to the first semiconductor die layer 101 and the second semiconductor die layer 102 through the RDL 1011 and conductive contact 1013, respectively. BGA packaging technology generally is an advanced semiconductor packaging technology, which is characterized in that a semiconductor chip is mounted on a front surface of a substrate, and a plurality of conductive elements such as solder balls are arranged in a matrix array, customarily referred to as ball grid array, on a back surface of the substrate. The BGA allows the semiconductor package to be bonded and electrically connected to an external PCB or other electronic devices. As shown in FIG. 1, the BGA 107 is closer to the active surface 101A than the passive surface 101B of the first semiconductor die layer 101.

Referring to FIG. 2, FIG. 2 is a portional enlarged cross sectional view A1 of the semiconductor package 10, in accordance with some embodiments of the present disclosure. Identical numeral annotations represent identical or similar elements and would not be repeated herein for brevity. The conductive contact 1013 includes a body 1013B and a mesa 1013A. The mesa 1013A has a tapered sidewall 1013′ connected with a top surface 1013″. As shown in FIG. 2, the top surface 1013″ of the mesa 1013A is coplanar with the top surface of the insulating layer 1012. Alternatively stated, sidewall 1013′ of the mesa 1013A is completely surrounded by the insulating layer 1012 and the seed layer 105, and only the top surface 1013″ of the mesa 1013A is in contact with the solder bump 103. Note the surface area SA1 (shown in dotted lines) of the mesa 1013A connected to the solder bump 103 is smaller than those shown in FIG. 3 and FIG. 4, hence, the solder bump 103 may possess a higher standoff in the final semiconductor package 10 compared to those shown in FIG. 3 and FIG. 4.

FIG. 3 shows a portional enlarged cross sectional view A2 of a semiconductor package 10, in accordance with some embodiments of the present disclosure. The conductive contact 1013 includes a body 1013B and a mesa 1013A. The mesa 1013A has a tapered sidewall 1013′ connected with a top surface 1013″. As shown in FIG. 3, the top surface 1013″ of the mesa 1013A is higher than the top surface of the insulating layer 1012. In FIG. 3, the mesa 1013A protrudes from the insulating layer 1012 by a distance D1. In some embodiments, D1 can be in a range of from about 1 μm to about 7 μm. Alternatively stated, sidewall 1013′ of the mesa 1013A is partially surrounded by the insulating layer 1012 and partially surrounded by the seed layer 105, and only the top surface 1013″ and a portion of the sidewall 1013′ are in contact with the solder bump 103. Note the surface area SA2 (shown in dotted lines) of the mesa 1013A connected to the solder bump 103 is smaller than that shown in FIG. 4 but greater than that shown in FIG. 2, hence, the solder bump 103 may possess a higher standoff in the final semiconductor package 10 compared to that shown in FIG. 4 and a lower standoff in the final semiconductor package 10 compared to that shown in FIG. 2. The greater the surface area of the mesa, the greater the bonding strength between the solder bump 103 and the mesa 1013A.

FIG. 4 shows a portional enlarged cross sectional view A3 of a semiconductor package 10, in accordance with some embodiments of the present disclosure. The conductive contact 1013 includes a body 1013B and a mesa 1013A. The mesa 1013A has a tapered sidewall 1013′ connected with a top surface 1013″. As shown in FIG. 4, the top surface 1013″ of the mesa 1013A is higher than the top surface of the molding compound. In FIG. 4, the mesa 1013A protrudes from the molding compound 1013 by a distance D2. In some embodiments, D2 can be in a range of from about 5 μm to about 10 μm. Alternatively stated, sidewall 1013′ of the mesa 1013A is neither surrounded by the insulating layer 1012 nor the seed layer 105 shown in previous figures. The top surface 1013″ and the sidewall 1013′ are in contact with the solder bump 103. Note the surface area SA3 (shown in dotted lines) of the mesa 1013A connected to the solder bump 103 is greater than those shown in FIG. 2 and FIG. 3, hence, the solder bump 103 may possess a lower standoff in the final semiconductor package 10 compared to that shown in FIG. 2 and FIG. 3.

FIG. 5 shows a cross sectional view of a semiconductor package 20, in accordance with some embodiments of the present disclosure. The semiconductor package 20 includes a first semiconductor die layer 201 having an active surface 201A and a passive surface 201B. The active surface 201A of the first semiconductor die layer 201 connects to a conductive contact 2011, e.g., an RDL. The conductive contact 2011 is further connected to a solder bump 203. In some embodiments, the solder bump 203 is a C4 bump. The solder bump 203 is closer to the active surface 201A than the passive 201B or back surface of the first semiconductor die layer 201.

In some embodiments, the RDL includes several layers, for example, a first via 2011A/a first line 2011B, a second via 2012A/a second line 2012B, and a third via 2013A. However, more or less layer of an RDL fitting to a particular design is encompassed in the scope of the present disclosure. The RDL is enclosed by an insulating layer 2012. Note the insulating layer 2012 may be formed at different manufacturing operations, as known by people having ordinary skill in the art. In FIG. 5, the first via 2011A has a bottom surface 2011″ and a sidewall 2011′. The bottom surface 2011″ is exposed from the insulating layer 2012. A seed layer 205 can be observed between the insulating layer 2012 and the sidewall 2011′ of the first via 2011A. Apart from the first via 2011A and the insulating layer 2012, seed layer 205 also extends between first line 2011B and the insulating layer 2012.

Note the surface area SA4 of the first via 2011A connected to the solder bump 203 is smaller than the surface area SA5 shown in FIG. 6, hence, the solder bump 203 may possess a higher standoff in the final semiconductor package 20 compared to those in the final semiconductor package 30 of FIG. 6.

FIG. 6 shows a cross sectional view of a semiconductor package 30, in accordance with some embodiments of the present disclosure. The semiconductor package 30 includes a first semiconductor die layer 301 having an active surface 301A and a passive surface 301B. The active surface 301A of the first semiconductor die layer 301 connects to a conductive contact 3011, e.g., an RDL. The conductive contact 3011 is further connected to a solder bump 303. In some embodiments, the solder bump 303 is a C4 bump. The solder bump 303 is closer to the active surface 301A than the passive 301B or back surface of the first semiconductor die layer 301.

In some embodiments, the RDL includes several layers, for example, a first via 3011A/a first line 3011B, a second via 3012A/a second line 3012B, and a third via 3013A. However, more or less layer of an RDL fitting to a particular design is encompassed in the scope of the present disclosure. The RDL is enclosed by an insulating layer 3012. In FIG. 6, the first via 3011A has a bottom surface 3011″ and a sidewall 3011′. The bottom surface 3011″ is exposed from the insulating layer 3012 and the sidewall 3011′ is partially exposed from the insulating layer 3012. A seed layer 305 can be observed between the insulating layer 3012 and a portion of the sidewall 3011′ of the first via 3011A. Apart from the first via 3011A and the insulating layer 3012, seed layer 305 also extends between first line 3011B and the insulating layer 3012.

Note the surface area SA5 of the first via 3011A connected to the solder bump 303 is greater than the surface area SA4 shown in FIG. 5, hence, the solder bump 303 may possess a lower standoff in the final semiconductor package 30 compared to those in the final semiconductor package 20 of FIG. 5.

FIG. 7A to FIG. 7H show cross sectional views of a sequence of a method for manufacturing a semiconductor package 10, in accordance with some embodiments of the present disclosure. Identical numeral annotations represent identical or similar elements and would not be repeated herein for brevity. In FIG. 7A, a carrier 701 is provided with a gluing layer 703. An insulating layer 1012 or a dielectric layer is subsequently formed over the gluing layer 703. The insulating layer 1012 may be made of, for example, phosphosilicate glass (PSG), borophosphosilicate glass (BPSG), fluorosilicate glass (FSG), SiO_(x)C_(y), Spin-On-Glass, Spin-On-Polymers, silicon carbon material, compounds thereof, composites thereof, combinations thereof, or the like, formed by any suitable method, such as spinning, chemical vapor deposition (CVD), and plasma-enhanced CVD (PECVD).

A photoresist 705 is deposited and patterned over the insulating layer 1012 such as by acceptable photolithography techniques. An etch operation is carried out to form a close-end trench 707 pattern in the insulating layer 1012. In some embodiments, the close-end trench 707 is a recess occupying a portion of the thickness of the insulating layer 1012 and not penetrating through the insulating layer 1012. In some embodiments, the remaining thickness T1 of the insulating layer 1012 under the close-end trench 707 is about 2 micrometer. Alternatively stated, a difference between thickness T1 and the thickness of the original insulating layer 1012 is the height of the mesa 1013A shown in FIG. 2 to FIG. 4. The thickness T1 is determined to be about 2 micrometer because longer back-side etching time is required if thicker than T1 and damages may be caused to the gluing layer during close-end trench 707 formation if thinner than T1.

In FIG. 7B, a conductive contact 1013 is formed in the close-end trench 707 by, for example, an electroplating operation. A seed layer is deposited in the openings of patterned photoresist. The seed layer (not shown) deposited over the insulating layer 1012 and the close-end trench 707 can be copper, titanium, the like, or a combination thereof, and can be deposited by sputtering, another PVD process, the like, or a combination thereof. A conductive material, such as copper, aluminum, the like, or a combination thereof, is deposited in the close-end trench 707 by electroless plating, electroplating, or the like. The photoresist 705 is removed, such as by an ash and/or flush process.

In FIG. 7C, dies 121, 123 of the first semiconductor die layer 101 is place over the insulating layer 1012. In some embodiments, dies 121, 123 can be known good dies (KGD) determined by a testing or probing operation. The KGD is attached using a pick-and-place tool. In some embodiments, the passive surface 101B or the back surface of the dies 121. 123 are in contact with the insulating layer 1012. The active surface 101A is facing the direction opposite to the carrier 701. In FIG. 7D, a molding compound 702 is applied over the conductive contacts 1013 and the dies 121, 123. A planarization operation is followed to at least expose the active surface 101A of the dies 121, 123 and the end portion of the conductive contact 1013 in order to expose the metallization portion for subsequent operations.

In FIG. 7E, an RDL 1011 is formed over the planarized surface of the molding compound 702 and being electrically connected to the dies 121, 123 and conductive contacts 1013. In FIG. 7F, the RDL 1011 is further processed to form electrical connection with a BGA 107. In some embodiments, an integrated passive device (IPD) is also placed at the same level of the BGA 107 and coupled with the RDL 1011. In FIG. G, the carrier 701 is debonded from the first semiconductor die layer 101, specifically, the carrier 701 is separated from the insulating layer by the property change of the gluing layer 703. The de-bonding may comprise exposing the gluing layer 703 to UV lights, such as a laser, or by exposing the adhesive to a solvent. The carrier 701 may comprise, for example, glass, silicon oxide, aluminum oxide, a combination thereof. The gluing layer 703 may be any suitable adhesive, such as UV glue, which loses its adhesive property when exposed to UV lights.

After the separation of the carrier 701 and the gluing layer 703, the insulating layer 1012 is exposed as a result. Referring back to FIG. 7A, due to the fact that a thickness T1 of the insulating layer 1012 is preserved when forming the closed-end trench 707, the conductive contact 1013 is not exposed immediately after the debonding operation discussed above. A subsequent and separate etching operation is carried out to consume at least the thickness T1 of the insulating layer 1012 in order to expose at least the top surface of the 1013″ of the mesa 1013A, as shown from FIG. 2 to FIG. 4. The etching operation can be any dry etch operation that is suitable in controlling the extent of etching depth. For example, a plasma etch can be applied to the insulating layer 1012 with a first plasma energy for etching to expose the top surface 1013″ of the mesa 1013A and obtain a structure as depicted in FIG. 2. In other embodiment, a second plasma energy can be applied to expose both the top surface 1013″ and a portion of the sidewall 1013′ of the mesa 1013A in order to obtain a structure as depicted in FIG. 3. For another embodiment, a third plasma energy can be adopted to expose both the top surface 1013″ and the complete sidewall 1013′ of the mesa 1013A in order to obtain a structure as depicted in FIG. 4. In some embodiments, the dry etching not only removes materials of the insulating layer 1012 but also a portion of the seed layer (not shown) deposited prior to the formation of the conductive contact 1013. Using dry etch to expose the conductive contact instead of using laser drilling can render smaller critical dimension of the conductive contact, a better overlay control, a high manufacturing through-put, and the counts of the conductive contact being irrelevant to the fabrication cost. Dry etching leverages a sophisticated etching technology in one manufacturing operation instead of a series of drilling operations.

In FIG. 7H, second semiconductor die layer 102 is pre-formed to have a solder bump 103 connected thereto, and the second semiconductor die layer 102 is coupled to the exposed conductive contact 1013 through the solder bump 103. Details of the interface between the conductive contact 1013 and the solder bump 103 can be referred to FIG. 2, FIG. 3, and FIG. 4 of the present disclosure.

Referring to FIG. 8A to FIG. 8H, FIG. 8A to FIG. 8H show cross sectional views of a sequence of a method for manufacturing a semiconductor package 30, in accordance with some embodiments of the present disclosure. In FIG. 8A, a carrier 801 is provided with a gluing layer 803. In FIG. 8B, an insulating layer 3012 or a first interlayer dielectric (ILD) is subsequently formed over the gluing layer 803. The insulating layer 3012 may be made of, for example, phosphosilicate glass (PSG), borophosphosilicate glass (BPSG), fluorosilicate glass (FSG), SiO_(x)C_(y), Spin-On-Glass, Spin-On-Polymers, silicon carbon material, compounds thereof, composites thereof, combinations thereof, or the like, formed by any suitable method, such as spinning, chemical vapor deposition (CVD), and plasma-enhanced CVD (PECVD). Also shown in FIG. 8B, a photolithography operation is carried out to form a close-end trench 805. In some embodiments, the remaining thickness T1 of the insulating layer 3012 under the close-end trench 805 is about 2 micrometer.

In FIG. 8C, a seed layer 305 is deposited over the insulating layer 3012 and a patterned photoresist 807 is further formed over the seed layer 305. The seed layer, such as a copper, titanium, or the like, is deposited on the insulating layer 3012, such as by sputtering or another physical vapor deposition (PVD) process. In FIG. 8D, a first RDL is formed by an electroplating operation, and the patterned photoresist 807 is removed. The first RDL includes a first via 3011A complying the trench of the insulating layer 3012 and a first line 3011B at the top surface of the insulating layer 3012. Note the removal of the patterned photoresist 807 may also remove the underlying seed layer 305.

In FIG. 8E, another insulating layer 3012 is formed over the first RDL. A second ILD is deposited over the first RDL. The second ILD may be a polyimide, polybenzoxazole (PBO), benzocyclobutene (BCB), the like, or a combination thereof. The second ILD can be deposited by a coating process, a lamination process, the like, or a combination thereof. Openings may be formed through the second ILD layer to the first RDL layer using acceptable photolithography techniques. Subsequent second RDL may be formed using the same or similar processes as discussed with regard to the first RDL. The second RDL includes a second via 3012A complying an opening of the second ILD and a second line 3012B at the top surface of the second ILD. Subsequently, another insulating layer 3012 is formed over the second RDL, particularly, a third ILD is deposited over the second RDL and a third via 3013A is formed in an opening of the third ILD. The number of the RDL can be determined according to different designs and is not a limiting demonstration herein.

A first semiconductor die layer 301 is formed over the RDL further away from the carrier 801 and electrically coupled to said RDL through a solder bump 307. An active surface 301A of the first semiconductor die layer 301 is facing layer of the RDL away from the carrier 801. In FIG. 8F, the carrier 801 is debonded from the RDL, specifically the carrier 801 is separated from the insulating layer 3012 by the property change of the gluing layer 803. The de-bonding may comprise exposing the gluing layer 803 to UV lights, such as a laser, or by exposing the adhesive to a solvent. The carrier 801 may comprise, for example, glass, silicon oxide, aluminum oxide, a combination thereof. The gluing layer 803 may be any suitable adhesive, such as UV glue, which loses its adhesive property when exposed to UV lights.

After the separation of the carrier 801 and the gluing layer 803, the insulating layer 3012 is exposed as a result. Referring back to FIG. 8B, due to the fact that a thickness T1 of the insulating layer 3012 is preserved when forming the closed-end trench 805, the conductive contact or the first via 3011A of the first RDL is not exposed immediately after the debonding operation discussed above. A subsequent and separate etching operation is carried out to consume at least the thickness T1 of the insulating layer 3012 in order to expose at least the top surface of the 1013″ of the mesa 1013A, as shown from FIG. 2 to FIG. 4. The etching operation can be any dry etch operation that is suitable in controlling the extent of etching depth. For example, a plasma etch can be applied to the insulating layer 3012 with a first plasma energy for etching to expose the top surface 1013″ of the mesa 1013A and obtain a structure as depicted in FIG. 2. In other embodiment, a second plasma energy can be applied to expose both the top surface 1013″ and a portion of the sidewall 1013′ of the mesa 1013A in order to obtain a structure as depicted in FIG. 3. For another embodiment, a third plasma energy can be adopted to expose both the top surface 1013″ and the complete sidewall 1013′ of the mesa 1013A in order to obtain a structure as depicted in FIG. 4. In some embodiments, the dry etching not only removes materials of the insulating layer 3012 but also a portion of the seed layer (not shown) deposited prior to the formation of the conductive contact or the first via 3011A. Using dry etch to expose the conductive contact instead of using laser drilling can render smaller critical dimension of the conductive contact, a better overlay control, a high manufacturing through-put, and the counts of the conductive contact being irrelevant to the fabrication cost. Dry etching leverages a sophisticated etching technology in one manufacturing operation instead of a series of drilling operations.

For example, as shown in FIG. 8G, a top surface and a portion of the sidewall of the conductive contact or the first via 3011A protrude from the insulating layer 3012 as a result of the dry etch operation. A surface area SA5 of the first via 3011A is previously discussed in FIG. 3 and can be referred thereto. In FIG. 8H, a solder bump 303 is further mounted to the exposed surface of the first via 3011A. The solder bump 303 is in contact with the surface area SA5 of the first via 3011A.

Referring to FIG. 9, FIG. 9 shows a cross sectional view of a semiconductor package 40, in accordance with some embodiments of the present disclosure. The semiconductor package 40 includes a substrate 3010 having a first surface 3010A and a second surface 3010B. In some embodiments, the substrate 3010 can be a redistribution layer (RDL) substrate. A first semiconductor die 301 is disposed over the first surface 3010A of the substrate 3010, for example, by bonding to a conductive via 3013A at the first surface 3010A. A conductive pad may be disposed over the conductive via 3013A in order to receive a solder bump 307 connecting the first semiconductor die 301 and the substrate 3010. In some embodiments, by having the active surface 301A facing the first surface 2010A, the first semiconductor die is flip-chip bonded to the substrate 3010.

As previously discussed, the substrate 3010 includes a plurality of conductive lines 3011B, 3012B, and conductive vias 3011A, 3012A, 3013A, which jointly form an interconnect structure in the substrate 3010. In some embodiments, the conductive lines 3011B, 3012B, and conductive vias 3011A, 3012A, 3013A jointly form a redistribution layer. For example, the conductive line 3011B is surrounded by a dielectric, or an insulating layer 3012. A conductive via 3011A is connected to the conductive line 3011B and penetrating the dielectric, or the insulating layer 3012. As shown in FIG. 9, the conductive via 3011A is exposed from the second surface 3010B and being connected to a conductive bump 901. In some embodiments, the conductive bump 901 is a copper pillar. In some embodiments, the conductive bump 901 and the conductive via 3011A are composed of substantially identical materials. In some embodiments, the conductive via 3013A in proximity to the first surface 3010A possesses a smaller dimension than the conductive via 3011A in proximity to the second surface 3010B.

As shown in FIG. 9, a seed layer 305S can be observed between the conductive via 3011A and the conductive bump 901. The seed layer 305S may be composed of suitable copper alloys which facilitate subsequent electroplating operation of the copper pillar 901. In some embodiments, when the formation of the conductive via 3011A includes certain operations such as laser drilling, the conductive via 3011A may include a wider end 3011W and a narrower end 3011N. The wider end 3011W is connected to the conductive lien 3011B and the narrower end 3011N is connected to the conductive bump 901. On the second surface 3010B, a conductive surface 3011C at the narrower end 3011N of the conductive via 3011A is exposed from the dielectric, or the insulating layer 3012, and the conductive surface 3011C is further connected to the conductive bump 901. As illustrated in FIG. 9, the conductive surface 3011C is coplanar with the dielectric, or the insulating layer 3012.

In some embodiments, a width of the seed layer 305S can be identical to a width W901 of the conductive bump 901, and may be wider than a narrower end 3011N of the conductive via 3011A. In other words, a portion of the seed layer 305S is disposed between the conductive via 3011A and the conductive bump 901, and a portion of the seed layer 305S is disposed between the dielectric, or the insulating layer 3012 at the second surface 3010B and the conductive bump 901.

The semiconductor package 40 further includes a solder bump 903 connected to the conductive bump 901 at an end opposite to the conductive via 3011A. In other embodiments, the solder bump may undergo a reflow process and appear as a solder ball. In some embodiments, the solder bump 903 can be substituted with other suitable material that is used to connect the semiconductor package 40 on a mother carrier, for example, a PCB.

Referring to FIG. 10, FIG. 10 shows a cross sectional view of a semiconductor package 50, in accordance with some embodiments of the present disclosure. Semiconductor package 50 is similar to semiconductor package 40 except for one of the conductive via 3011A in proximity to the second surface 3010B being protruding from the dielectric, or the insulating layer 3012. Instead of being coplanar with the second surface 3010B, the conductive surface 3011C is at a level different from the that of the second surface 3010B. As shown in FIG. 10, a portion of the seed layer 305S is disposed between the conductive surface 3011C and the conductive bump 901, a portion of the seed layer 305S is disposed between the dielectric, or the insulating layer 3012 at the second surface 3010B and the conductive bump 901, and a portion of the seed layer 305S is disposed between the sidewall of the conductive bump 3011A and the conductive bump 901. The conductive surface 3011C in the semiconductor package 50 can be identified by the contour of the seed layer 305S.

Referring to FIG. 11A, FIG. 11A shows a cross sectional view of a semiconductor package 60, in accordance with some embodiments of the present disclosure. Semiconductor package 60 is similar to semiconductor package 40 except for an additional conductive pattern 902 being located on the second surface 3010B of the substrate 3010. The conductive pattern 902 may possess a thinner profile than the conductive bump 901. The conductive pattern 902 may be composed of substantially identical materials as the conductive bump 901. In some embodiments, the conductive pattern 902 and the conductive bump 901 can be collectively referred to a conductive pattern layer 9010. In some embodiments, the conductive pattern 902 can be in a line shape serving as a signal routing on the second surface 3010B. In some embodiments, the conductive pattern can be in a patch shape serving as a shielding layer preventing electromagnetic (EM) interference which may affect the first semiconductor die 301 or other EM sensitive components in the semiconductor package 60. In some embodiments, the conductive pattern 902 can be connected to the conductive bump 901 and serving as a ground line. As indicated by dotted lines in FIG. 11A, an interface 305B may be observed in a position of the conductive bump 901 leveling with the conductive pattern 902. The interface 305B may be formed by a discontinuance in electroplating operations. Moreover, a seed layer 305S can be observed between the second surface and the conductive pattern layer 9010, including the conductive bump 901 and the conductive pattern 902. The seed layer 305S may be first patterned on the second surface 3010B in accordance with the pattern of the subsequently formed conductive pattern layer 9010.

Referring to FIG. 11B, FIG. 11B shows a cross sectional view of a semiconductor package 70, in accordance with some embodiments of the present disclosure. Semiconductor package 70 is similar to semiconductor package 60 except that the conductive pattern 902′ is disconnected from the conductive bump 901. In some embodiments, the conductive pattern 902′ is electrically isolated from the conductive bump 901. In some embodiments, the conductive pattern 902′ can be in a line shape serving as a signal routing on the second surface 3010B. In some embodiments, the conductive pattern can be in a patch shape serving as a shielding layer preventing electromagnetic (EM) interference which may affect the first semiconductor die 301 or other EM sensitive components in the semiconductor package 70. A seed layer 305S can be observed between the second surface and the conductive pattern layer 9010, including the conductive bump 901 and the conductive pattern 902. The seed layer 305S also shows a discontinuance between the conductive bump 901 and the conductive pattern 902′.

Referring to FIG. 12A, FIG. 12A shows a cross sectional view of a semiconductor package 80, in accordance with some embodiments of the present disclosure. Semiconductor package 80 is similar to semiconductor package 60 except for one of the conductive via 3011A in proximity to the second surface 3010B being protruding from the dielectric, or the insulating layer 3012. As indicated by dotted lines in FIG. 12A, an interface 305B may be observed in a position of the conductive bump 901 leveling about with the conductive pattern 902 but conformally reflect the morphology of conductive via 9011A protruding from the insulating layer 3012. The interface 305B may be formed by a discontinuance in electroplating operations.

Referring to FIG. 12B, FIG. 12B shows a cross sectional view of a semiconductor package 90, in accordance with some embodiments of the present disclosure. Semiconductor package 90 is similar to semiconductor package 70 except for one of the conductive via 3011A in proximity to the second surface 3010B being protruding from the dielectric, or the insulating layer 3012.

Some embodiments of the present disclosure provide a semiconductor package. The semiconductor package includes a first semiconductor die layer having an active surface, a conductive contact electrically coupled to the active surface, a sidewall of the conductive contact being surrounded by an insulating layer; and a solder bump connected to the conductive contact. A seed layer is between the sidewall of the conductive contact and the insulating layer.

Some embodiments of the present disclosure provide a method for manufacturing a semiconductor package. The method includes providing a carrier, forming an insulating layer over the carrier, forming a first semiconductor die layer over the insulating layer, debonding the carrier from the insulating layer, and exposing the conductive contact from the insulating layer by an etching operation. The forming a first semiconductor die layer over the insulating layer further includes forming a shallow trench in the insulating layer, forming a conductive contact in the shallow trench, and placing first semiconductor die over the insulating layer.

Some embodiments of the present disclosure provide a method for manufacturing a semiconductor package. The method includes providing a carrier, forming a first semiconductor die layer over the carrier, debonding the carrier from the first polymer layer, and exposing the conductive contact from the first polymer layer by an etching operation. The forming a first semiconductor die layer over the carrier includes forming a first polymer layer over the carrier, forming a shallow trench in the first polymer layer, forming a conductive contact in the shallow trench, and placing first semiconductor die over the first polymer layer.

Some embodiments of the present disclosure provide a semiconductor package, including a substrate having a first surface and a second surface opposite to the first surface, a semiconductor die connected to the first surface of the substrate, and a conductive bump connected to the conductive via at the second surface. The substrate includes a conductive line surrounded by a dielectric and a conductive via connected to the conductive line and penetrating the dielectric at the second surface.

Some embodiments of the present disclosure provide a semiconductor package, including a redistribution layer (RDL) substrate having a first surface and a second surface opposite to the first surface. A first RDL at the second surface has a conductive surface exposed from a dielectric of the RDL substrate. The semiconductor package further includes a semiconductor die connected to a second RDL at the first surface, and a copper pillar connected to the conductive surface.

Some embodiments of the present disclosure provide a semiconductor package, including a redistribution layer (RDL) substrate having a first surface and a second surface opposite to the first surface, a semiconductor die bonded to the first surface, a conductive pattern layer on the second surface, and a seed layer between the second surface and the conductive pattern layer.

The foregoing outlines features of several embodiments so that those skilled in the art may better understand the aspects of the present disclosure. Those skilled in the art should appreciate that they may readily use the present disclosure as a basis for designing or modifying other operations and structures for carrying out the same purposes and/or achieving the same advantages of the embodiments introduced herein. Those skilled in the art should also realize that such equivalent constructions do not depart from the spirit and scope of the present disclosure, and that they may make various changes, substitutions, and alterations herein without departing from the spirit and scope of the present disclosure.

Moreover, the scope of the present application is not intended to be limited to the particular embodiments of the process, machine, manufacture, composition of matter, means, methods and steps described in the specification. As one of ordinary skill in the art will readily appreciate from the disclosure of the present invention, processes, machines, manufacture, compositions of matter, means, methods, or steps, presently existing or later to be developed, that perform substantially the same function or achieve substantially the same result as the corresponding embodiments described herein may be utilized according to the present invention. Accordingly, the appended claims are intended to include within their scope such processes, machines, manufacture, compositions of matter, means, methods, or steps. 

What is claimed is:
 1. A semiconductor package, comprising: a substrate having a first surface and a second surface opposite to the first surface, the substrate comprising: a conductive line surrounded by a dielectric; and a conductive via connected to the conductive line and penetrating the dielectric at the second surface; a semiconductor die connected to the first surface of the substrate; a conductive bump connected to the conductive via at the second surface; and a seed layer between the conductive via and the conductive bump.
 2. The semiconductor package of claim 1, wherein the conductive bump is a copper pillar.
 3. The semiconductor package of claim 1, wherein the seed layer is in contact with the conductive via and the dielectric at the second surface.
 4. The semiconductor package of claim 1, wherein the conductive via protrudes from the second surface.
 5. The semiconductor package of claim 1, wherein the conductive via and the conductive line are a portion of a redistribution layer (RDL).
 6. The semiconductor package of claim 1, wherein the conductive via comprises a wider end connecting with the conductive line and a narrower end connecting with the conductive bump.
 7. The semiconductor package of claim 1, further comprising a solder bump connected to the conductive bump at an end opposite to the conductive via.
 8. The semiconductor package of claim 1, further comprising a conductive pattern at the second surface.
 9. The semiconductor package of claim 8, wherein the conductive pattern is connected with the conductive bump.
 10. The semiconductor package of claim 8, further comprising a seed layer between the second surface and the conductive pattern.
 11. A semiconductor package, comprising: a redistribution layer (RDL) substrate having a first surface and a second surface opposite to the first surface, a first RDL at the second surface comprising a conductive surface exposed from a dielectric of the RDL substrate; a semiconductor die connected to a second RDL at the first surface, and a copper pillar connected to the conductive surface.
 12. The semiconductor package of claim 11, wherein the conductive surface is coplanar with the second surface.
 13. The semiconductor package of claim 12, further comprising a seed layer between the conductive surface and the copper pillar.
 14. The semiconductor package of claim 11, wherein the first RDL at the second surface comprises a conductive via protruding from the dielectric of the RDL substrate.
 15. The semiconductor package of claim 14, further comprising a seed layer between a sidewall of the conductive via and the copper pillar.
 16. The semiconductor package of claim 11, further comprising: a conductive pattern at the second surface of the RDL substrate; and a seed layer between the conductive pattern and the second surface.
 17. A semiconductor package, comprising: a redistribution layer (RDL) substrate having a first surface and a second surface opposite to the first surface; a semiconductor die bonded to the first surface; a conductive pattern layer on the second surface; and a seed layer between the second surface and the conductive pattern layer; wherein the conductive pattern layer comprises a copper pillar and a copper pad, the copper pillar being thicker than the copper pad.
 18. The semiconductor package of claim 17, wherein the copper pillar and the copper pad are electrically isolated.
 19. The semiconductor package of claim 14, further comprising an interface in the copper pillar reflecting a morphology of the conductive via.
 20. The semiconductor package of claim 17, further comprising an interface in a position of the copper pillar leveling with the copper pad. 